Method for determining the dose corrections to be applied to an IC manufacturing process by a matching procedure
US10578978B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2016 |
| Grant date | Mar 3, 2020 |
| Priority date | — |
| Expiry date | Oct 5, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70516
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method is provided to easily determine the parameters of a second process for manufacturing from the parameters of a first process. Metrics representative of the differences between the two processes are computed from a number of values of the parameters, which can be measured for the two processes on a calibration layout, or which can be determined from pre-existing values for layouts or reference data for the two processes by an interpolation/extrapolation procedure. The number of metrics is selected so that their combination gives a precise representation of the differences between the two processes in all areas of a design. Advantageously, the metrics are calculated as a product of convolution of the target design and a compound of a kernel function and a deformation function. A reference physical model of the reference process is determined. A sizing correction to be applied to the edges of the design produced by the reference process is calculated. It is then converted, totally or partially, into a dose correction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.