Patent · US Active

Data distribution fabric in scalable GPUs

US10580109B2 · kind B2 · utility

2Cited by

2References

20Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Altug Koker · Cameron Park, US
Lakshminarayanan Striramassarma · Folsom, US
Akif Ali · Rancho Cordova, US

Key dates

Filing date	May 21, 2019
Grant date	Mar 3, 2020
Priority date	—
Expiry date	May 21, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH04L49/109
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

One embodiment provides for a processor comprising a three-dimensional (3D) integrated circuit stack including multiple graphics processor cores and interconnect logic to interconnect the graphics processor cores of the 3D integrated circuit stack to enable data distribution between the graphics processor cores over a virtual channel including multiple programmatically pre-assigned traffic classifications.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.