Patent · US Active

Wafer level packaging with integrated antenna structures

US10580745B1 · kind B1 · utility

2Cited by

4References

17Claims

0Family size

Assignee

GlobalFoundries Inc. · KY

Inventors

Marcel Wieland · Radebeul, DE
Christian Goetze · Wohlenschwil, CH

Key dates

Filing date	Aug 31, 2018
Grant date	Mar 3, 2020
Priority date	—
Expiry date	Aug 31, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/12105
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

RF semiconductor chips may be packaged on wafer level on the basis of a two-step process for providing a package material, thereby providing very short electrical connections between antenna structures formed in the package material and the semiconductor chip. In some illustrative embodiments, the antenna structures may be provided above the semiconductor chip, which results in a very space-efficient overall configuration.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.