Photosensitive resin composition
US10584205B2 · kind B2 · utility
2Cited by
0References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2016 |
| Grant date | Mar 10, 2020 |
| Priority date | — |
| Expiry date | Mar 21, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02118
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A highly sensitive photosensitive resin composition that can afford a cured film having a low stressfulness, a high degree of elongation, and an excellent adhesion to a metal material, copper among others, is provided. A photosensitive resin composition including an alkali-soluble resin having an organic group derived from an aliphatic diamine.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.