Substrate processing apparatus and substrate processing method
US10591823B2 · kind B2 · utility
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2References
20Claims
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Key dates
| Filing date | Dec 18, 2015 |
| Grant date | Mar 17, 2020 |
| Priority date | — |
| Expiry date | Jan 15, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70433
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A substrate processing apparatus includes a hot plate which supports and heats a substrate, a light source which emits etching energy beam such that the etching energy beam etches the substrate held by the hot plate, a window device which is positioned between the light source and the hot plate and transmits the etching energy beam emitted by the light source toward the substrate, and an adjusting device which adjusts emission amounts of the etching energy beam from portions of the window device toward the substrate such that the adjusting device reduces difference in etching amounts of portions of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.