Surface treatment methods and compositions therefor
US10593538B2 · kind B2 · utility
1Cited by
12References
64Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 22, 2018 |
| Grant date | Mar 17, 2020 |
| Priority date | — |
| Expiry date | Mar 22, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The disclosure provides methods and compositions therefor for treating a surface wherein a surface treatment layer is formed on the surface, thereby minimizing or preventing pattern collapse as the surface is subjected to typical cleaning steps in the semiconductor manufacturing process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.