System and method for monitoring wafer handling and a wafer handling machine
US10593575B2 · kind B2 · utility
2Cited by
6References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 29, 2016 |
| Grant date | Mar 17, 2020 |
| Priority date | — |
| Expiry date | Jul 29, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S901/27
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Systems, machines, and methods for monitoring wafer handling are disclosed herein. A system for monitoring wafer handling includes a sensor and a controller. The sensor is capable of being secured to an assembled wafer handling machine. The controller is in electronic communication with the sensor and includes control logic. The control logic is configured to store a reference output of the sensor when the wafer handling machine is aligned and is configured to generate an indication signal when a difference between the reference output and a current output of the sensor exceeds a threshold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.