Patent · US Active

Semiconductor module comprising an encapsulating compound that covers at least one semiconductor component

US10593608B2 · kind B2 · utility

2Cited by

4References

11Claims

0Family size

Assignee

HERAEUS DEUTSCHLAND GMBH & CO. KG · DE

Inventors

Ronald Eisele · Surendorf, DE
Anton-Zoran MIRIC · Alzenau, DE
Frank Krüger · Könnern, DE
Wolfgang Schmitt · Rodgau, DE

Key dates

Filing date	May 9, 2018
Grant date	Mar 17, 2020
Priority date	—
Expiry date	May 9, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19107
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor module (10) contains a ceramic interconnect device (50) having at least one semiconductor component (20). The at least one semiconductor component (20) is covered by an encapsulating compound (30) which contains a cured inorganic cement and has a thermal expansion coefficient in the range of 2 to 10 ppm/K. The ceramic of the ceramic interconnect device (50) is selected from ceramics based on aluminum oxide, aluminum nitride or silicon nitride.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.