Semiconductor device
US10593617B2 · kind B2 · utility
21Cited by
6References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 2, 2018 |
| Grant date | Mar 17, 2020 |
| Priority date | — |
| Expiry date | Mar 2, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10674
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to one embodiment, a semiconductor device includes a first board including a plurality of terminals, a semiconductor chip flip-chip mounted to the first board, and an insulating layer covering the first board and the semiconductor chip. The plurality of terminals include at least one first terminal electrically connected to the semiconductor chip, and at least one second terminal that is not connected to the semiconductor chip, wherein the at least one second terminal is not covered by the insulating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.