Patent · US Active

Packaged devices with integrated antennas

US10593634B2 · kind B2 · utility

1Cited by

12References

20Claims

0Family size

Assignee

Analog Devices, Inc. · US

Inventors

Youn-Jae Kook · Winchester, US
Yeonsung Kim · Bedford, US
Dipak Sengupta · Boxborough, US

Key dates

Filing date	Dec 30, 2016
Grant date	Mar 17, 2020
Priority date	—
Expiry date	Dec 30, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Various embodiments of an integrated device package with integrated antennas are disclosed. In some embodiments, an antenna can be defined along a die pad of the package. In some embodiments, an antenna can be disposed in a first packaging component, and an integrated device die can be disposed in a second packaging component. The first and second packaging components can be stacked on one another and electrically connected. In some embodiments, a package can include one or a plurality of antennas disposed along a wall of a package body. The plurality of antennas can be disposed facing different directions from the package.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.