Movable heatsink utilizing flexible heat pipes
US10595439B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2018 |
| Grant date | Mar 17, 2020 |
| Priority date | — |
| Expiry date | Jun 25, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10159
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Embodiments described herein may include apparatuses, systems and/or processes to provide a cooling apparatus that includes a first heatsink, a second movable heatsink and a flexible thermal conductor physically and thermally coupled with the first and second heatsinks, where the flexible thermal conductor is to flex and remain thermally coupled with the first heatsink and the second heatsink, when the second heatsink is moved relative to the first heatsink. The first heatsink may be coupled to a heat source such as a processor that may be coupled with a PCB. Also, the movable heatsink may allow access to components, such as dual in-line memory modules (DIMMs) that are next to the first heatsink and under the movable second heatsink. Other embodiments may be described and/or claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.