David Shia
33Patents
5h-index
67Co-inventors
72Inventor score
Filing activity: May 31, 2001 → Oct 31, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7042727B2 | Heat sink mounting and interface mechanism and method of assembling same | Electricity | 44 | Expired |
| US6542367B2 | Securing heat sinks | Emerging Cross-Sectional Technologies | 23 | Expired |
| US6522545B2 | Securing heat sinks | Emerging Cross-Sectional Technologies | 20 | Expired |
| US7161238B2 | Structural reinforcement for electronic substrate | Electricity | 9 | Expired |
| US6519153B1 | Heat sink retention frame | Emerging Cross-Sectional Technologies | 9 | Expired |
| US10595439B2 | Movable heatsink utilizing flexible heat pipes | Electricity | 4 | Active |
| US8710858B2 | Micro positioning test socket and methods for active precision alignment and co-planarity feedback | Electricity | 3 | Active |
| US11449111B2 | Scalable, high load, low stiffness, and small footprint loading mechanism | Electricity | 2 | Active |
| US9366482B2 | Adjustable heat pipe thermal unit | Electricity | 2 | Active |
| US9255945B2 | Micro positioning test socket and methods for active precision alignment and co-planarity feedback | Electricity | 2 | Active |
| US8797053B2 | Positioning and socketing for semiconductor dice | Physics | 2 | Active |
| US10677845B2 | Converged test platforms and processes for class and system testing of integrated circuits | Physics | 1 | Active |
| US9279830B2 | Test probe structures and methods including positioning test probe structures in a test head | Physics | 1 | Active |
| US9977054B2 | Etching for probe wire tips for microelectronic device test | Physics | 1 | Active |
| US9069014B2 | Wire probe assembly and forming process for die testing | Emerging Cross-Sectional Technologies | 1 | Active |
| US9354273B2 | Composite wire probe test assembly | Physics | 0 | Active |
| US11976671B2 | Vacuum modulated two phase cooling loop performance enhancement | Electricity | 0 | Active |
| US12057370B2 | Vacuum modulated two phase cooling loop efficiency and parallelism enhancement | Physics | 0 | Active |
| US12248344B2 | Technologies for liquid cooling interfaces | Physics | 0 | Active |
| US12279395B2 | Patterned bolster plate and composite back plate for semiconductor chip LGA package and cooling assembly retention | Electricity | 0 | Active |
| US9134343B2 | Sort probe gripper | Physics | 0 | Active |
| US12309933B2 | Magnetically secured semiconductor chip package loading assembly | Electricity | 0 | Active |
| US12133357B2 | Cold plate architecture for liquid cooling of devices | Electricity | 0 | Active |
| US9535095B2 | Anti-rotation for wire probes in a probe head of a die tester | Emerging Cross-Sectional Technologies | 0 | Active |
| US11842943B2 | Electronic systems with inverted circuit board with heat sink to chassis attachment | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.