Dynamic determination of metal film thickness from sheet resistance and TCR value
US10598477B2 · kind B2 · utility
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Key dates
| Filing date | Feb 1, 2017 |
| Grant date | Mar 24, 2020 |
| Priority date | — |
| Expiry date | Apr 2, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R27/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Metal film thickness can be determined using the sheet resistance, resistivity, and temperature coefficient of resistivity for the metal film. Variation in film thickness measurements caused by resistivity can be reduced or eliminated. A probe head may be used for some of the measurements of the metal film. The probe head can include a temperature sensor used during sheet resistance measurements. A wafer on a chuck is heated, such as using the chuck or the probe head, for the measurements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.