Patent · US Active

Leadframe with vertically spaced die attach pads

US10600724B2 · kind B2 · utility

0Cited by

1References

22Claims

0Family size

Assignee

TEXAS INSTRUMENTS INCORPORATED · US

Inventors

Chia-Yu Chang · Taipei, TW
Chih-Chien Ho · New Taipei, TW
Steven Su · 東區, TW

Key dates

Filing date	May 10, 2016
Grant date	Mar 24, 2020
Priority date	—
Expiry date	May 10, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A leadframe includes a first die attach pad (“DAP”) having a first longitudinally extending edge surface and a second DAP having a first longitudinally extending edge surface. The second DAP is positioned with the first longitudinally extending edge surface thereof in adjacent, laterally and vertically spaced relationship with the first longitudinally extending edge surface of the first DAP.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.