Vertical module and perpendicular pin array interconnect for stacked circuit board structure
US10602612B1 · kind B1 · utility
10Cited by
4References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 15, 2019 |
| Grant date | Mar 24, 2020 |
| Priority date | — |
| Expiry date | Jul 15, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Stacked circuit board structures are described. In an embodiment, a plurality of vertical devices serves as electrical interconnections between the first circuit board and the second circuit board. In an embodiment, a plurality of vertical interconnects or pins serve as electrical interconnections between the first circuit board and the second circuit board. The vertical interconnects or pins may be arranged side-by-side with a plurality of vertical or horizontal devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.