Apparatus for the material-bonded connection of connection partners of a power-electronics component

US10603741B2 · kind B2 · utility

Assignee

• SEMIKRON ELEKTRONIK GMBH & CO. KG · DE

Inventors

• Ingo Bogen · Nuremberg, DE
• Heiko Braml · Ebermannstadt, DE
• Christian Göbl · Koblenzer Straße, DE
• Ulrich Sagebaum · Feucht, DE
• Jürgen Windischmann · Pommersfelden, DE

Key dates

• Filing date: Nov 20, 2016
• Grant date: Mar 31, 2020
• Expiry date: Oct 17, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/86203
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A pressing ram having an elastic cushion element and intended for the material-bonded press-sintering connection of a first connection partner to a second connection partner of a power-electronics component. The elastic cushion element of the pressing ram is enclosed by a dimensionally stable frame, within which the cushion element and a guide part of the pressing ram are guided for linear movement such that the dimensionally stable frame lowers onto the first connection partner, or a workpiece carrier with the first connection partner arranged therein, and, following abutment against the same, the pressing ram together with the elastic cushion element is lowered onto the second connection partner and the elastic cushion exerts a pressure necessary for connecting the first connection partner to the second connection partner.