Heiko Braml
4Patents
0h-index
7Co-inventors
27Inventor score
Filing activity: May 12, 2008 → Nov 20, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8564126B2 | Semiconductor arrangement | Electricity | 0 | Active |
| US10603741B2 | Apparatus for the material-bonded connection of connection partners of a power-electronics component | Electricity | 0 | Active |
| US8324717B2 | Power semiconductor module with a hermetically tight circuit arrangement and method for producing such a module | Electricity | 0 | Active |
| US9768036B2 | Power semiconductor substrates with metal contact layer and method of manufacture thereof | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.