Superstrate and a method of using the same
US10606171B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 14, 2018 |
| Grant date | Mar 31, 2020 |
| Priority date | — |
| Expiry date | Feb 14, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31116
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A body of a superstrate can be used to form an adaptive planarization layer over a substrate that has a non-uniform topography. A body of a superstrate can have bending characteristics that are well suited to achieve both conformal and planarization behavior. The body can have a surface and a thickness in a range of t1 to t2, t1=(Pd4/2Eh)1/3; t2=(5Pd4/2Eh)1/3; P is a pressure corresponding to a capillary force between the body and a planarization precursor material; d is a bending distance; E is Young's modulus for the body; and h is a step height difference between two adjacent regions of a substrate. In an embodiment, a thickness can be selected and used to determine the maximum out-of-plane displacement, wmax, for conformal behavior is sufficient and that wmax for planarization behavior is below a predetermined threshold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.