Projection exposure apparatus for semiconductor lithography with reduce thermal deformation
US10606179B2 · kind B2 · utility
2Cited by
1References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 28, 2019 |
| Grant date | Mar 31, 2020 |
| Priority date | — |
| Expiry date | Mar 28, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/7015
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A projection exposure apparatus for semiconductor lithography has a mirror arrangement that is exposed to thermal loads in operation. The mirror arrangement includes a mirror carrier having an optically active surface arranged on a top surface of the mirror carrier. A cooling system is integrated into the mirror carrier. The cooling system has cooling lines through which a cooling fluid circulates. The cooling system is designed so that the thermal load introduced into the mirror carrier via the optically active surface is dissipated at least partially into a rear region remote from the top surface of the mirror carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.