Power distribution networks for monolithic three-dimensional semiconductor integrated circuit devices
US10607938B1 · kind B1 · utility
21Cited by
6References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 26, 2018 |
| Grant date | Mar 31, 2020 |
| Priority date | — |
| Expiry date | Oct 26, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/834
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Devices and methods are provided for fabricating monolithic three-dimensional semiconductor integrated circuit devices which include power distribution networks that are implemented with power distribution planes disposed below a stack of device tiers, in between device tiers, and/or above the device tiers to distribute positive and negative power supply voltage to field-effect transistor devices of the device tiers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.