Semiconductor module
US10607940B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 7, 2018 |
| Grant date | Mar 31, 2020 |
| Priority date | — |
| Expiry date | Aug 7, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/185
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor module includes a metal core layer that includes: a first metal layer and a second metal layer on the first metal layer, wherein a portion of the second metal layer is removed to expose a surface of the first metal layer, the removed portion of the second metal layer defining a cavity in the metal core layer having the exposed surface of the first metal layer as a bottom surface, and at least one of a side wall and the bottom surface of the cavity has a smoother surface profile than a surface of the first metal layer that is not exposed by the cavity and under the second metal layer; and a semiconductor element provided in the cavity, affixed to the bottom surface of the cavity with a fixing material containing a resin component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.