Yoshiki Hamada
8Patents
2h-index
10Co-inventors
40Inventor score
Filing activity: May 11, 2011 → Feb 13, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8988885B2 | Electronic circuit module and method for producing the same | Emerging Cross-Sectional Technologies | 5 | Active |
| US8791783B2 | Electronic component to be embedded in substrate and component-embedded substrate | Emerging Cross-Sectional Technologies | 5 | Active |
| US10607940B2 | Semiconductor module | Electricity | 2 | Active |
| US9484372B2 | Substrate for embedding imaging device and method for manufacturing same, and imaging apparatus | Electricity | 1 | Active |
| US10957652B2 | Circuit board | Electricity | 0 | Active |
| US9713259B2 | Communication module | Electricity | 0 | Active |
| US9078370B2 | Substrate with built-in electronic component | Electricity | 0 | Active |
| US9560743B2 | Multilayer circuit substrate having core layer with through-hole | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.