Two-component bump metallization
US10608158B2 · kind B2 · utility
0Cited by
16References
25Claims
0Family size
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Key dates
| Filing date | Sep 29, 2017 |
| Grant date | Mar 31, 2020 |
| Priority date | — |
| Expiry date | Sep 29, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/81203
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A technique relates to a structure. An under-bump-metallization (UBM) structure includes a first region and a second region. The first and second regions are laterally positioned in the UBM structure. The first region includes a superconducting material. A substrate opposes the UBM structure. A superconducting solder material joins the first region to the substrate and the second region to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.