Inventor · White Plains, NY, US

Eric P. Lewandowski

34Patents
3h-index
38Co-inventors
55Inventor score

Filing activity: May 29, 2012 → Dec 9, 2020

Most-cited inventions

PatentTitleAreaCited byStatus
US9586857B2 Controlling fragmentation of chemically strengthened glass Chemistry; Metallurgy 13 Active
US9472789B2 Thin, flexible microsystem with integrated energy source Emerging Cross-Sectional Technologies 8 Active
US10692831B1 Stud bumps for post-measurement qubit frequency modification Electricity 5 Active
US10881788B2 Delivery device including reactive material for programmable discrete delivery of a substance Human Necessities 3 Active
US9508566B2 Wafer level overmold for three dimensional surfaces Electricity 3 Active
US8987130B2 Reactive bonding of a flip chip package Electricity 2 Active
US10879202B1 System and method for forming solder bumps Electricity 2 Active
US9586291B2 Adhesives for bonding handler wafers to device wafers and enabling mid-wavelength infrared laser ablation release Emerging Cross-Sectional Technologies 2 Active
US9321245B2 Injection of a filler material with homogeneous distribution of anisotropic filler particles through implosion Electricity 2 Active
US9738560B2 Controlling fragmentation of chemically strengthened glass Chemistry; Metallurgy 2 Active
US8815725B2 Low alpha particle emission electrically-conductive coating Emerging Cross-Sectional Technologies 1 Active
US10833241B1 Thermalization structure for cryogenic temperature devices Electricity 1 Active
US9806299B2 Cathode for thin film microbattery Emerging Cross-Sectional Technologies 1 Active
US11195799B2 Hybrid readout package for quantum multichip bonding Electricity 1 Active
US10096802B2 Homogeneous solid metallic anode for thin film microbattery Emerging Cross-Sectional Technologies 1 Active
US10069116B2 Cathode for thin film microbattery Emerging Cross-Sectional Technologies 0 Active
US11766729B2 Molten solder injection head with vacuum filter and differential gauge system Performing Operations; Transporting 0 Active
US11749605B2 Hybrid under-bump metallization component Electricity 0 Active
US11258132B2 Microbattery separator Electricity 0 Active
US10937735B2 Hybrid under-bump metallization component Electricity 0 Active
US10608158B2 Two-component bump metallization Electricity 0 Active
US11990437B2 System and method for forming solder bumps Electricity 0 Active
US9181440B2 Low alpha particle emission electrically-conductive coating Emerging Cross-Sectional Technologies 0 Active
US11165010B2 Cold-welded flip chip interconnect structure Electricity 0 Active
US10388929B2 Microbattery separator Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.