Powder for conductive material, ink for conductive material, conductive paste, and method for producing powder for conductive material
US10610928B2 · kind B2 · utility
1Cited by
4References
4Claims
0Family size
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Key dates
| Filing date | Sep 27, 2016 |
| Grant date | Apr 7, 2020 |
| Priority date | — |
| Expiry date | Nov 4, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09D133/10
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A powder for a conductive material according to an embodiment of the present invention includes a large number of particles that contain copper as a main component and having an average primary particle diameter of 1 nm or more and 200 nm or less. The particles contain titanium on surfaces or inside thereof, and a content of the titanium is 0.003 atomic percent or more and 0.5 atomic percent or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.