Heat dissipation structure for electric circuit device
US10615096B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 2, 2017 |
| Grant date | Apr 7, 2020 |
| Priority date | — |
| Expiry date | Aug 2, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/473
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a heat dissipation structure for an electric circuit device excellent in mass-productivity and heat radiation performance. A heat dissipation structure for an electric circuit device, the structure including a layered structure comprising: a heatsink exposed on the electric circuit device; a thermal conductive member; and a cooler, wherein the thermal conductive member is a ceramic-resin composite in which a resin composition is impregnated in a ceramic sintered body, the ceramic sintered body comprising ceramic primary particles integrated into a three-dimensional structure, and wherein the thermal conductive member is arranged such that the thermal conductive member directly contacts with at least one of the heatsink and the cooler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.