Ryuji Koga
6Patents
2h-index
15Co-inventors
48Inventor score
Filing activity: May 13, 1992 → Mar 6, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6469259B2 | Wiring board | Electricity | 4 | Expired |
| US5172083A | Microwave plasma processing apparatus | Electricity | 2 | Expired |
| US10615096B2 | Heat dissipation structure for electric circuit device | Electricity | 1 | Active |
| US11034623B2 | Thermal conductive member and heat dissipation structure including the same | Chemistry; Metallurgy | 0 | Active |
| US12083784B2 | Temporary bonding body of ceramic resin composite and metal plate, method for producing same, object to be transported including the temporary bonding body, and method for transporting same | Chemistry; Metallurgy | 0 | Active |
| US11492299B2 | Nitride ceramic resin composite body | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.