Integrated circuit package
US10615134B2 · kind B2 · utility
3Cited by
0References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 15, 2018 |
| Grant date | Apr 7, 2020 |
| Priority date | — |
| Expiry date | Apr 27, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package is described comprising an integrated circuit die and an antenna structure coupled to the integrated circuit die and comprising a stacked arrangement of metal and dielectric layers, wherein a first metal layer includes a planar antenna and at least one further metal layer comprises an artificial dielectric layer. The integrated circuit package may improve the directionality of the antenna and reduces the sensitivity of the antenna to the printed circuit board on which the integrated circuit package is mounted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.