Polymer substrate for flexible electronics microfabrication and methods of use
US10615191B2 · kind B2 · utility
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2References
13Claims
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Key dates
| Filing date | Apr 21, 2017 |
| Grant date | Apr 7, 2020 |
| Priority date | — |
| Expiry date | Feb 19, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K2102/311
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Provided are flexible electronics stacks and methods of use. An example flexible electronics stack includes a flexible polymeric substrate film and a rigid inorganic electronic component. The flexible polymeric substrate film includes a thermoset polymer prepared by curing a monomer solution; wherein the monomer solution comprises about 25 wt % to about 65 wt % of one or more thiol monomers and from about 25 wt % to about 65 wt % of one or more co-monomers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.