Radu Reit
10Patents
1h-index
8Co-inventors
39Inventor score
Filing activity: Apr 13, 2017 → Jun 23, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10615191B2 | Polymer substrate for flexible electronics microfabrication and methods of use | Electricity | 1 | Active |
| US11065807B2 | Method of manufacturing a heat-shrink elastomeric element | Chemistry; Metallurgy | 0 | Active |
| US10736212B2 | Substrates for stretchable electronics and method of manufacture | Electricity | 0 | Active |
| US12186974B2 | Method of manufacturing a heat-shrink elastomeric element | Chemistry; Metallurgy | 0 | Active |
| US11427684B2 | Photopatterned planarization layers for flexible electronics | Electricity | 0 | Active |
| US12264268B2 | Optically clear adhesives using semi- interpenetrating polymer networks | Performing Operations; Transporting | 0 | Active |
| US12221515B2 | Optically clear resin composition, flexible optical film and image display device | Emerging Cross-Sectional Technologies | 0 | Active |
| US11667111B2 | Method for forming flexible cover lens films | Chemistry; Metallurgy | 0 | Active |
| US10840120B2 | Temporary bonding layer for flexible electronics fabrication | Electricity | 0 | Active |
| US12071533B2 | Polymer substrate design parameters for electronic microfabrication | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.