Methods of manufacturing flexible printed circuit boards
US10617012B2 · kind B2 · utility
5Cited by
7References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 8, 2017 |
| Grant date | Apr 7, 2020 |
| Priority date | — |
| Expiry date | Mar 13, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a flexible electronic device is described. The method comprises arranging an electronic component on a temporary carrier, providing a flexible laminate comprising an adhesive layer, pressing the temporary carrier and the flexible laminate together with the adhesive layer facing the temporary carrier such that the electronic component is pushed into the adhesive layer, and removing the temporary carrier. Further, a corresponding flexible electronic device is described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.