Andreas Zluc
29Patents
4h-index
24Co-inventors
59Inventor score
Filing activity: Jan 30, 2008 → Jul 24, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9418930B2 | Power module | Electricity | 12 | Active |
| US8789271B2 | Method for integrating an electronic component into a printed circuit board | Emerging Cross-Sectional Technologies | 6 | Active |
| US10779413B2 | Method of embedding a component in a printed circuit board | Emerging Cross-Sectional Technologies | 6 | Active |
| US10617012B2 | Methods of manufacturing flexible printed circuit boards | Emerging Cross-Sectional Technologies | 5 | Active |
| US10187997B2 | Method for making contact with a component embedded in a printed circuit board | Electricity | 4 | Active |
| US9253888B2 | Method for integrating an electronic component into a printed circuit board or a printed circuit board intermediate product, and printed circuit board or printed circuit board intermediate product | Emerging Cross-Sectional Technologies | 3 | Active |
| US8685196B2 | Method for producing a multilayer printed circuit board, adhesion prevention material and multilayer printed circuit board and use of such a method | Emerging Cross-Sectional Technologies | 2 | Active |
| US8541689B2 | Method for removing a part of a planar material layer and multilayer structure | Emerging Cross-Sectional Technologies | 1 | Active |
| US11523520B2 | Method for making contact with a component embedded in a printed circuit board | Electricity | 1 | Active |
| US10765005B2 | Embedding component with pre-connected pillar in component carrier | Electricity | 1 | Active |
| US11049778B2 | Component carrier with a stepped cavity and a stepped component assembly embedded within the stepped cavity | Electricity | 0 | Active |
| US11171092B2 | Component with dielectric layer for embedding in component carrier | Electricity | 0 | Active |
| US10709023B2 | Placement of component in circuit board intermediate product by flowable adhesive layer on carrier substrate | Electricity | 0 | Active |
| US9967972B2 | Circuit board having an asymmetric layer structure | Electricity | 0 | Active |
| US10426040B2 | Method for producing a circuit board element | Electricity | 0 | Active |
| US11495513B2 | Component carrier with embedded semiconductor component and embedded highly-conductive block which are mutually coupled | Electricity | 0 | Active |
| US11682661B2 | Hermetic optical component package having organic portion and inorganic portion | Electricity | 0 | Active |
| US12245377B2 | Component carrier with embedded semiconductor component and embedded highly-conductive block which are mutually coupled | Electricity | 0 | Active |
| US12185478B2 | Printed circuit board having embedded component | Electricity | 0 | Active |
| US12424504B2 | Component embedded in component carrier and having an exposed side wall | Electricity | 0 | Active |
| US11749613B2 | Component with dielectric layer for embedding in component carrier | Electricity | 0 | Active |
| US12165940B2 | Component carrier with surface-contactable component embedded in laminated stack | Electricity | 0 | Active |
| US12400968B2 | Component with dielectric layer for embedding in component carrier | Electricity | 0 | Active |
| US12382585B2 | Method for embedding a component in a printed circuit board | General | 0 | Revoked |
| US12075561B2 | Embedding component in component carrier by component fixation structure | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.