Method for cleaning bonding interface before bonding
US10618082B2 · kind B2 · utility
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6Claims
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Key dates
| Filing date | Feb 26, 2018 |
| Grant date | Apr 14, 2020 |
| Priority date | — |
| Expiry date | Nov 25, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/8503
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a method for cleaning a bonding interface before bonding. The method includes: providing a first surface and a second surface for bonding, the first surface being a non-crystal surface and the second surface being a crystal surface; and cleaning the first surface and the second surface with ammonia respectively before bonding, wherein at least one of parameters of an ammonia concentration and a cleaning temperature for cleaning the first surface is higher than a counterpart of parameters for cleaning the second surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.