Self-stopping polishing composition and method for bulk oxide planarization
US10619076B2 · kind B2 · utility
1Cited by
0References
8Claims
0Family size
Assignee
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Key dates
| Filing date | Feb 8, 2019 |
| Grant date | Apr 14, 2020 |
| Priority date | — |
| Expiry date | Feb 8, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/762
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention provides a chemical-mechanical polishing composition comprising an abrasive, a self-stopping agent, an aqueous carrier, and optionally, a cationic polymer, and provides a method suitable for polishing a substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.