Cleaning compositions and methods of use therefor
US10619126B2 · kind B2 · utility
1Cited by
1References
78Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 14, 2016 |
| Grant date | Apr 14, 2020 |
| Priority date | — |
| Expiry date | Jul 22, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present disclosure is directed to non-corrosive cleaning compositions that are useful primarily for removing residues (e.g., plasma etch and/or plasma ashing residues) and/or metal oxides from a semiconductor substrate as an intermediate step in a multistep manufacturing process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.