Patent · US Active

Etching solution for copper and copper alloy surfaces

US10619251B2 · kind B2 · utility

0Cited by

3References

16Claims

0Family size

Assignee

Atotech Deutschland GmbH & Co. KG · DE

Inventors

Fabian Michalik · Berlin, DE
Norbert Lützow · Berlin, DE
Josef Gaida · Berlin, DE
Thomas Hulsmann · Velbert, DE
Gabriela Schmidt · Berlin, DE

Key dates

Filing date	Dec 14, 2016
Grant date	Apr 14, 2020
Priority date	—
Expiry date	Jan 4, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/0796
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An etching solution for copper and copper alloy surfaces comprising at least one acid, at least one oxidising agent suitable to oxidise copper, at least one source of halide ions and further at least one polyamide containing at least one polymeric moiety according to formula (I) wherein each a is independently from each other selected from 1, 2 and 3; each b is an integer independently from each other ranging from 5 to 10000; each R1 is a monovalent residue independently from each other selected from the group consisting of substituted or unsubstituted C1-C8-alkyl groups and a method for its use are provided. Such etching solution is particularly useful for retaining the shape of treated copper and copper alloy lines.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.