Josef Gaida
8Patents
1h-index
30Co-inventors
47Inventor score
Filing activity: Dec 10, 2007 → May 10, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9076773B2 | Wire bondable surface for microelectronic devices | Electricity | 1 | Active |
| US11035051B2 | Acidic aqueous composition for electrolytic copper plating | Chemistry; Metallurgy | 1 | Active |
| US8986789B2 | Stress-reduced Ni-P/Pd stacks for bondable wafer surfaces | Emerging Cross-Sectional Technologies | 1 | Active |
| US12054843B2 | Acidic aqueous composition for electrolytically depositing a copper deposit | Chemistry; Metallurgy | 0 | Active |
| US9057145B2 | Electrodeposition method with analysis of the electrolytic bath by solid phase extraction | Chemistry; Metallurgy | 0 | Active |
| US10619251B2 | Etching solution for copper and copper alloy surfaces | Electricity | 0 | Active |
| US12071702B2 | Acidic aqueous composition for electrolytic copper plating | Chemistry; Metallurgy | 0 | Active |
| US11091849B2 | Bath and method for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.