Conveying mechanism
US10622237B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2019 |
| Grant date | Apr 14, 2020 |
| Priority date | — |
| Expiry date | Apr 18, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67386
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A conveying mechanism for conveying a wafer unit having a wafer disposed inside of and supported on an annular frame by a holding tape includes a housing tray housing the wafer unit therein and a transport unit supporting and transporting the housing tray between wafer treating apparatus. The housing tray includes a ceiling plate and a bottom plate that are interconnected by a pair of side walls facing each other across an opening defined in a side through which the wafer unit can be taken into and out of the housing tray. An air flow generator is disposed on the ceiling plate for generating air downflows in the housing tray that are directed from the ceiling plate into the opening. The transport unit conveys wafer units, one by one, between the wafer treating apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.