Power module and method for manufacturing power module
US10622281B2 · kind B2 · utility
1Cited by
1References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 15, 2017 |
| Grant date | Apr 14, 2020 |
| Priority date | — |
| Expiry date | Feb 15, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/3735
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention concerns a power module comprising a heat sink, a substrate on which a power die is attached, the power module further comprises between the substrate and the heat sink, a first and a second materials, the first material having a thermal conductivity that is higher than the thermal conductivity of the second material, the second material having a first cavity below the power die and the first material is in the first cavity of the second material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.