Lead frame and method for manufacturing the same
US10622286B2 · kind B2 · utility
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5Claims
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Assignee
Inventor
Key dates
| Filing date | Jan 17, 2018 |
| Grant date | Apr 14, 2020 |
| Priority date | — |
| Expiry date | Jan 17, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/97
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead frame has a concavity formed on the upper-surface side of a metal plate and columnar portions defined by the concavity. A horizontally deepest portion regarding a side face shape of the concavity is positioned lower than the vertical center position of the concavity. Thereby, overhangs projecting from the top faces of the columnar portions rarely cause shape defects or burr defects and thus the lead frame has an enhanced capability, by the columnar portions, of preventing a sealing resin from coming off without sacrificing the freedom of wiring design.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.