Patent · US Active

Semiconductor package device and method of manufacturing the same

US10622318B2 · kind B2 · utility

2Cited by

5References

20Claims

0Family size

Assignee

ADVANCED SEMICONDUCTOR ENGINEERING, INC. · TW

Inventors

Seokbong Kim · Paju-si, KR
Sunju Park · Seoul, KR

Key dates

Filing date	Apr 26, 2017
Grant date	Apr 14, 2020
Priority date	—
Expiry date	Apr 26, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/48091
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor package device includes a carrier, an electronic component, a package body and an antenna. The carrier has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The electronic component is disposed on the first surface of the carrier. The package body is disposed on the first surface of the carrier and encapsulates the electronic component. The antenna is disposed on at least a portion of the lateral surface of the carrier.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.