Method for manufacturing an electronic device and electronic device

US10622346B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Andre Schmenn · Sachsenkam, DE
• Stefan Pompl · Landshut, DE
• Damian Sojka · Regensburg, DE
• Katharina Umminger · Wenzenbach, DE

Key dates

• Filing date: Sep 29, 2017
• Grant date: Apr 14, 2020
• Expiry date: Jan 23, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10D84/60
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method for manufacturing an electronic device includes: providing a semiconductor carrier including first and second vertically integrated electronic structures laterally spaced apart from each other, an electrical connection layer disposed over a first side of the semiconductor carrier and electrically connecting the first and second vertically integrated electronic structures with each other; mounting the semiconductor carrier on a support carrier with the first side of the semiconductor carrier facing the support carrier; thinning the semiconductor carrier from a second side opposite the first side; and removing material of the semiconductor carrier in a separation region between the first and second vertically integrated electronic structures to separate a first semiconductor region of the first vertically integrated electronic structure from a second semiconductor region of the second vertically integrated electronic structure with the first and second vertically integrated electronic structures remaining electrically connected with each other via the electrical connection layer.