Semiconductor device with different material layers in element separation portion trench and method for manufacturing semiconductor device
US10622443B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 20, 2016 |
| Grant date | Apr 14, 2020 |
| Priority date | — |
| Expiry date | Sep 24, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B41/30
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device of the present invention includes a semiconductor substrate, stripe-shaped trenches for separating the semiconductor substrate into a plurality of active regions, a buried film having a projecting portion that projects from the semiconductor substrate, buried into the trenches, a source region and drain region of a second conductivity type, which are a pair of regions formed in the active region, for providing a channel region of a first conductivity type for a region therebetween, and a floating gate consisting of a single layer striding across the source region and the drain region, projecting beyond the projecting portion in a manner not overlapping the projecting portion, in which an aspect ratio of the buried film is 2.3 to 3.67.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.