MEMS devices and processes
US10623852B2 · kind B2 · utility
1Cited by
4References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 3, 2018 |
| Grant date | Apr 14, 2020 |
| Priority date | — |
| Expiry date | Oct 3, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2499/11
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The application relates to MEMS transducers comprising at least one support structure for connecting a backplate structure of the transducer with an underlying substrate. A strengthening portion is provided in the region of the support structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.