Electrical connection tape
US10625356B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 10, 2016 |
| Grant date | Apr 21, 2020 |
| Priority date | — |
| Expiry date | Aug 7, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2463/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A thermal managing electrical connection tape includes a carrier film and a composition including solder powder, with the composition being applied to the carrier film. The composition includes a soldering flux having the solder powder disposed therein. The composition contains between about 50 wt % and about 70 wt % soldering flux. The composition further contains between about 30 wt % and about 50 wt % solder powder. A method of fabricating a thermal managing electrical connection tape includes providing a composition including at least one of a soldering flux and epoxy and/or acrylic, adding a solder powder to the composition, casting the composition on a carrier film, drying the carrier film in a drying furnace to form a dried tape, and cutting the dried tape to a desired width to form a thermal managing electrical connection tape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.