Patent assignee · US · COMPANY

ALPHA ASSEMBLY SOLUTIONS INC.

44Patents
44Active
44Granted
55Portfolio score

Filing activity: Oct 17, 2007 → Oct 5, 2023

Most-cited patents

PatentTitleAreaCited byStatus
US10322471B2 Low temperature high reliability alloy for solder hierarchy Electricity 3 Active
US10535628B2 Sintering materials and attachment methods using same Emerging Cross-Sectional Technologies 1 Active
US11162007B2 Sintering paste Electricity 1 Active
US11193031B2 Dielectric ink composition Electricity 1 Active
US10259980B2 Sintering powder Electricity 1 Active
US10710336B2 Composite and multilayered silver films for joining electrical and mechanical components Emerging Cross-Sectional Technologies 1 Active
US10998284B2 Low pressure sintering powder Electricity 1 Active
US11411150B2 Advanced solder alloys for electronic interconnects Electricity 0 Active
US12233483B2 Low temperature soldering solutions for polymer substrates, printed circuit boards and other joining applications Performing Operations; Transporting 0 Active
US11699632B2 Methods for attachment and devices produced using the methods Emerging Cross-Sectional Technologies 0 Active
US12278022B2 Stretchable interconnects for flexible electronic surfaces Electricity 0 Active
US12246376B2 Sinter-ready silver films Electricity 0 Active
US11123823B2 Cost-effective lead-free solder alloy for electronic applications Performing Operations; Transporting 0 Active
US11929341B2 Nano copper paste and film for sintered die attach and similar applications Electricity 0 Active
US11390054B2 Composite and multilayered silver films for joining electrical and mechanical components Emerging Cross-Sectional Technologies 0 Active
US10682732B2 Engineered polymer-based electronic materials Electricity 0 Active
US10625356B2 Electrical connection tape Chemistry; Metallurgy 0 Active
US10130995B2 Method for manufacturing metal powder Electricity 0 Active
US11624000B2 Graphene enhanced and engineered materials for membrane touch switch and other flexible electronic structures Electricity 0 Active
US11389865B2 Sintering materials and attachment methods using same Electricity 0 Active
US10894302B2 Multilayered metal nano and micron particles Electricity 0 Active
US12113039B2 Low pressure sintering powder Electricity 0 Active
US11139089B2 Stretchable interconnects for flexible electronic surfaces Electricity 0 Active
US11090768B2 Lead-free and antimony-free tin solder reliable at high temperatures Performing Operations; Transporting 0 Active
US10465295B2 Jettable inks for solar cell and semiconductor fabrication Emerging Cross-Sectional Technologies 0 Active

Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.