Method for calibrating a component mounting apparatus
US10629465B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 4, 2019 |
| Grant date | Apr 21, 2020 |
| Priority date | — |
| Expiry date | May 4, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/81132
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention concerns the calibration of a component mounting apparatus configured to mount components on a substrate whose mounting places do not contain local markings. The substrate contains either global substrate markings attached to its edge or other global features that can be used to mount the components. Calibration is carried out by means of a calibration plate which has several calibration positions distributed two-dimensionally over the calibration plate and provided with first optical markings, a test chip which has second optical markings, and a holder attached to the bonding station for temporarily accommodating the calibration plate. The number and arrangement of the calibration positions of the calibration plate and the number and arrangement of the mounting places of the substrate are—apart from possible exceptions—different from one another.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.