Florian Speer
4Patents
1h-index
5Co-inventors
33Inventor score
Filing activity: Jul 23, 2013 → May 4, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9721819B2 | Method for mounting semiconductors provided with bumps on substrate locations of a substrate | Electricity | 2 | Active |
| US10629465B2 | Method for calibrating a component mounting apparatus | Electricity | 1 | Active |
| US9956692B2 | Kinematic holding system for a placement head of a placement apparatus | Electricity | 1 | Active |
| US9364953B2 | Kinematic holding system for a placement head of a placement apparatus | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.