Cross-point array device including conductive fuse material layer
US10629653B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 30, 2019 |
| Grant date | Apr 21, 2020 |
| Priority date | — |
| Expiry date | Apr 30, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N70/882
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
In an embodiment, a cross-point array device includes a pillar-shaped structure disposed in an intersection region where a first conductive line overlaps a second conductive line. The pillar-shaped structure includes a resistance change material layer disposed between the first conductive line and the second conductive line. The pillar-shaped structure includes one or more conductive fuse material layers, each of which is disposed between the first or second conductive line and the resistance change material layer. The melting point of the conductive fuse material layer is higher than the melting point of the resistance change material layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.