Additive manufacturing technology (AMT) inverted pad interface
US10631405B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2019 |
| Grant date | Apr 21, 2020 |
| Priority date | — |
| Expiry date | Sep 20, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10287
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer printed circuit board includes a first dielectric layer and a second dielectric layer, each layer having a top surface and a bottom surface. The first dielectric layer is positioned above the second dielectric layer with the bottom surface of the first dielectric layer facing the top surface of the second dielectric layer. The top surface of the second dielectric layer has a conductive trace. The second dielectric layer has a through-hole that extends through the conductive trace. The multilayer printed circuit board includes an inverted pad interface structure including an inverted pad provided on the bottom surface of the first dielectric layer, a first solder layer provided on a surface of the inverted pad, a second solder layer provided on the conductive trace, and a copper wire positioned within the through-hole to provide the vertical and electrical connection with the conductive trace.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.